iST continues to strengthen industry–academia collaboration and talent development. Recently, we delivered a specialized industry lecture at the Department of Semiconductor Engineering, Lunghwa University of Science and Technology for junior and senior students. The course, titled “More than Moore: From AI Chips to the New 3D World of Advanced Packaging,” focused on AI chip applications and the development of advanced packaging and 3D IC technologies in the semiconductor industry.

Through real-world case studies, the session highlighted key insights into semiconductor technology evolution and industry perspectives, helping students build a foundational understanding of future trends and bridge the gap between academia and industry.

iST believes the value of industry–academia collaboration goes beyond knowledge transfer—it also helps cultivate industry perspectives and engineering mindsets. Through industry lectures and practical sharing, iST aims to nurture future-ready talent with hands-on capabilities.